Closed-form impedance model for annular through-silicon via...

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Closed-form impedance model for annular through-silicon via pairs in three-dimensional integration

Wang, Gaofeng, Chen, Aobo, Wang, Bing-Zhong, Liang, Feng
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Language:
english
Journal:
IET Microwaves, Antennas & Propagation
DOI:
10.1049/iet-map.2014.0606
Date:
January, 2015
File:
PDF, 591 KB
english, 2015
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