Closed-form impedance model for annular through-silicon via pairs in three-dimensional integration
Wang, Gaofeng, Chen, Aobo, Wang, Bing-Zhong, Liang, FengLanguage:
english
Journal:
IET Microwaves, Antennas & Propagation
DOI:
10.1049/iet-map.2014.0606
Date:
January, 2015
File:
PDF, 591 KB
english, 2015