Wafer fusion bonding and its application to...

Journal of Micromechanics and Microengineering 1991 / 09 Vol. 1; Iss. 3

Wafer fusion bonding and its application to silicon-on-insulator fabrication

Harendt, C, Appel, W, Graf, H -G, Hofflinger, B, Penteker, E
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Volume:
1
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/1/3/003
Date:
September, 1991
File:
PDF, 556 KB
english, 1991
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