Integration of laser die transfer and magnetic...

Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement

Kuran, Emine Eda, Berg, Yuval, Tichem, Marcel, Kotler, Zvi
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/4/045008
Date:
April, 2015
File:
PDF, 1.39 MB
english, 2015
Conversion to is in progress
Conversion to is failed