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Integration of laser die transfer and magnetic self-assembly for ultra-thin chip placement
Kuran, Emine Eda, Berg, Yuval, Tichem, Marcel, Kotler, ZviVolume:
25
Language:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/25/4/045008
Date:
April, 2015
File:
PDF, 1.39 MB
english, 2015