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[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - System-level thermal modeling for 3D circuits: Characterization with a 65nm memory-on-logic circuit
Santos, Cristiano, Vivet, Pascal, Dutoit, Denis, Garrault, Philippe, Peltier, Nicolas, Reis, RicardoYear:
2013
Language:
english
DOI:
10.1109/3dic.2013.6702379
File:
PDF, 1.01 MB
english, 2013