[IEEE 2013 IEEE International 3D Systems Integration Conference (3DIC) - San Francisco, CA, USA (2013.10.2-2013.10.4)] 2013 IEEE International 3D Systems Integration Conference (3DIC) - Thermal aware Graphene based Through Silicon Via design for 3D IC
Hossain, Nahid M, Hossain, MunEm, Yousuf, Abdul Hamid Bin, Chowdhury, Masud HYear:
2013
Language:
english
DOI:
10.1109/3dic.2013.6702385
File:
PDF, 1.59 MB
english, 2013