[IEEE 2015 International Conference on Electronic Packaging...

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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Preparation and characterization of organic light emitting devices using hybrid encapsulation materials properties of OLED using hybrid encapuslaton materials

Ho Jung Chang,, Byung Min Park,, Sang Hee Lee,, Yang Geun Jo,, Ji Mook Kim,, Jae Jin Jung,, Jaeho Pyee,
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Year:
2015
Language:
english
DOI:
10.1109/icep-iaac.2015.7111036
File:
PDF, 874 KB
english, 2015
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