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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Influence of nano additives on mechanical properties and reliability of interconnects made by electrically conductive adhesives on elastic substrates for printed electronics application
Sitek, Janusz, Koscielski, Marek, Zhang, Yan, Fan, Jing-yu, Ma, Shiwei, Liu, JohanYear:
2014
Language:
english
DOI:
10.1109/icept.2014.6922625
File:
PDF, 762 KB
english, 2014