Telemetry for implantable medical devices: Part 3 - Data...

IEEE Solid-State Circuits Magazine 2014 / 23 Vol. 6; Iss. 4

Telemetry for implantable medical devices: Part 3 - Data telemetry

Bihr, Ulrich, Tianyi Liu,, Ortmanns, Maurits
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Volume:
6
Language:
english
Journal:
IEEE Solid-State Circuits Magazine
DOI:
10.1109/mssc.2014.2347812
Date:
November, 2014
File:
PDF, 1.88 MB
english, 2014
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