![](/img/cover-not-exists.png)
Thermal Fatigue Reliability Analysis and Structural Optimization Based on a Robust Method for Microelectronics FBGA Packages
Wan, Yi, Huang, Hailong, Pecht, MichaelVolume:
15
Language:
english
Journal:
IEEE Transactions on Device and Materials Reliability
DOI:
10.1109/tdmr.2015.2417888
Date:
June, 2015
File:
PDF, 1.04 MB
english, 2015