Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
2007 Vol. 25; Iss. 2
Reactive ion etching technique for via-hole applications in thick GaAs wafers
Wang, Chih-Cheng, Lin, Yu-Lu, Lin, Shun-Kuan, Li, Chun-Sheng, Huang, Hou-Kuei, Wu, Chang-Luen, Chang, Chian-Sern, Wang, Yeong-HerVolume:
25
Year:
2007
Language:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.2437157
File:
PDF, 732 KB
english, 2007