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SPIE Proceedings [SPIE International Symposium on Microelectronics and Assembly - Singapore, Singapore (Monday 27 November 2000)] Microelectronic Yield, Reliability, and Advanced Packaging - Thermal characterization of tape BGA package by modeling
Han, Jiang-Bo, Tan, Cher Ming, Peng, Yeng-Kaung, Mahalingam, Mali, Prasad, KrishnamacharVolume:
4229
Year:
2000
Language:
english
DOI:
10.1117/12.404880
File:
PDF, 1.24 MB
english, 2000