Microvia Filling over Self-Assembly Disulfide Molecule on...

Electrochemical and Solid-State Letters 2005 Vol. 8; Iss. 11

Microvia Filling over Self-Assembly Disulfide Molecule on Au and Cu Seed Layers

Dow, Wei-Ping, Yen, Ming-Yao
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Volume:
8
Year:
2005
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.2039957
File:
PDF, 3.44 MB
english, 2005
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