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Thermal Stability of Copper Contact Metallization Using Ru-Containing Liner
Seo, S.-C., Yang, C.-C., Hu, C.-K., Kerber, A., Fan, S., Horak, D., Canaperi, D., Papa Rao, S., Haran, B., Doris, B.Volume:
14
Year:
2011
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.3545963
File:
PDF, 2.58 MB
english, 2011