Microstructural characterization of copper metallic deposition by electroplating growth for SIP applications
Durand, Céline, Domengès, Bernadette, Le Duc, PhilippeVolume:
1288
Language:
english
Journal:
MRS Proceedings
DOI:
10.1557/opl.2011.424
Date:
January, 2011
File:
PDF, 1.34 MB
english, 2011