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[IEEE 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Singapore (2014.12.3-2014.12.5)] 2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) - Sintering of Ag paste for power devices die attach on Cu surfaces
Manikam, Vemal Raja, Tolentino, Erik NinoYear:
2014
Language:
english
DOI:
10.1109/eptc.2014.7028252
File:
PDF, 366 KB
english, 2014