[IEEE The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems - Las Vegas, NV, USA (1-4 June 2004)] The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) - Thermal conductance enhancement of particle-filled thermal interface materials using carbon nanotube inclusions
Xuejiao Hu,, Linan Jiang,, Goodson, K.E.Year:
2004
Language:
english
DOI:
10.1109/itherm.2004.1319155
File:
PDF, 719 KB
english, 2004