Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 3 Vol. 5; Iss. 3

Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing

Hsiang-Yao Hsiao,, Trigg, Alastair David, Tai Chong Chai,
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2015.2398416
Date:
March, 2015
File:
PDF, 1.54 MB
english, 2015
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