Thermal Model Design and Analysis of High-Power LED...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 5 Vol. 5; Iss. 5

Thermal Model Design and Analysis of High-Power LED Headlamp Cooling Device Based on the Thermoelectric Effect

Wang, Jing, Zhao, Xin-Jie, Cai, Yi-Xi, Zhang, Chun, Bao, Wei-Wei
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Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2015.2413777
Date:
May, 2015
File:
PDF, 2.60 MB
english, 2015
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