Modeling Pattern Density Dependent Bump Formation in Copper...

Electrochemical and Solid-State Letters 2003 Vol. 6; Iss. 3

Modeling Pattern Density Dependent Bump Formation in Copper Electrochemical Deposition

Im, Yeon Ho, Bloomfield, Max O., Sen, Suchira, Cale, Timothy S.
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Volume:
6
Year:
2003
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.1541256
File:
PDF, 756 KB
english, 2003
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