Influence of Additives on Copper Electrodeposition on...

Journal of The Electrochemical Society 2003 Vol. 150; Iss. 6

Influence of Additives on Copper Electrodeposition on Physical Vapor Deposited (PVD) Copper Substrates

Kang, Myungchan, Gewirth, Andrew A.
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Volume:
150
Year:
2003
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1572152
File:
PDF, 627 KB
english, 2003
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