[ECS 214th ECS Meeting - Honolulu, HI (October 12 - October 17, 2008)] ECS Transactions - Effect of Pre-bonding Thermal Treatment on the Bonding Interface Evolution in Direct Si-Si Hydrophilic Wafer Bonding
Ventosa, Caroline, Rieutord, François, Libralesso, Laure, Fournel, Frank, Morales, Christophe, Moriceau, H.Volume:
16
Year:
2008
Language:
english
DOI:
10.1149/1.2982888
File:
PDF, 508 KB
english, 2008