![](/img/cover-not-exists.png)
MSA as a Supporting Electrolyte in Copper Electroplating for Filling of Damascene Trenches and Through Silicon Vias
Ki Cho, Sung, Jun Kim, Myung, Jeong Kim, JaeVolume:
14
Year:
2011
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.3557758
File:
PDF, 1.54 MB
english, 2011