An analytical model of thermal mechanical stress induced by...

Chinese Physics B 2015 / 05 Vol. 24; Iss. 5

An analytical model of thermal mechanical stress induced by through silicon via

Dong, Gang, Shi, Tao, Zhao, Ying-Bo, Yang, Yin-Tang
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Volume:
24
Language:
english
Journal:
Chinese Physics B
DOI:
10.1088/1674-1056/24/5/056601
Date:
May, 2015
File:
PDF, 959 KB
english, 2015
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