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Low Profile Integratable Inductor Fabricated Based on LTCC Technology for Microprocessor Power Delivery Applications
Lim, Michele Hui Fern, Liang, Zhenxian, van Wyk, Jacobus DanielVolume:
30
Language:
english
Journal:
IEEE Transactions on Components and Packaging Technologies
DOI:
10.1109/tcapt.2007.892099
Date:
March, 2007
File:
PDF, 955 KB
english, 2007