Survey of High-Temperature Polymeric Encapsulants for Power...

IEEE Transactions on Components Packaging and Manufacturing Technology 2015 / 2 Vol. 5; Iss. 2

Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

Yao, Yiying, Lu, Guo-Quan, Boroyevich, Dushan, Ngo, Khai D. T.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
5
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2337300
Date:
February, 2015
File:
PDF, 4.61 MB
english, 2015
Conversion to is in progress
Conversion to is failed