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Effects of Ceria Abrasive Particle Size Distribution below Wafer Surface on In-Wafer Uniformity during Chemical Mechanical Polishing Processing
Kim, Hojoong, Yang, Ji Chul, Kim, Myungjoon, Oh, Dong-won, Lee, Chil-Gee, Kim, Sang-Yong, Kim, TaesungVolume:
158
Year:
2011
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3562559
File:
PDF, 4.24 MB
english, 2011