A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate
Seok, Seonho, Kim, Janggil, Lahti, MarkkuVolume:
56
Language:
english
Journal:
Microwave and Optical Technology Letters
DOI:
10.1002/mop.28355
Date:
June, 2014
File:
PDF, 323 KB
english, 2014