Vertically stacked RF switches by wafer-scale three-dimensional integration
Chen, C.L., Chen, C.K., Yost, D.-R., Knecht, J.M.Volume:
48
Year:
2012
Language:
english
Journal:
Electronics Letters
DOI:
10.1049/el.2012.0951
File:
PDF, 248 KB
english, 2012