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Plasma Enhanced Chemical Vapor Deposition of Manganese on Low-k Dielectrics for Copper Diffusion Barrier Application
Jourdan, N., Barbarin, Y., Croes, K., Kong Siew, Y., Van Elshocht, S., Tokei, Z., Vancoille, E.Volume:
2
Language:
english
Journal:
ECS Solid State Letters
DOI:
10.1149/2.002303ssl
Date:
December, 2012
File:
PDF, 350 KB
english, 2012