Ultrasonic bonding method for heterogeneous microstructures...

Ultrasonic bonding method for heterogeneous microstructures using self-balancing jig

Lee, Kyoung G., Shin, Sujeong, Kim, Byeong Il, Bae, Nam Ho, Lee, Moon-Keun, Lee, Seok Jae, Lee, Tae Jae
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Volume:
15
Year:
2015
Language:
english
Journal:
Lab Chip
DOI:
10.1039/c4lc01473a
File:
PDF, 1.62 MB
english, 2015
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