![](/img/cover-not-exists.png)
Ultra-compact high transmittance photonic wire bends for monolithic integration on III/V-semiconductors
Schuller, Ch., Höfling, S., Forchel, A., Etrich, C., Iliew, R., Lederer, F., Pertsch, T., Reithmaier, J.P.Volume:
42
Year:
2006
Language:
english
Journal:
Electronics Letters
DOI:
10.1049/el:20062195
File:
PDF, 136 KB
english, 2006