Ultra-compact high transmittance photonic wire bends for...

Ultra-compact high transmittance photonic wire bends for monolithic integration on III/V-semiconductors

Schuller, Ch., Höfling, S., Forchel, A., Etrich, C., Iliew, R., Lederer, F., Pertsch, T., Reithmaier, J.P.
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Volume:
42
Year:
2006
Language:
english
Journal:
Electronics Letters
DOI:
10.1049/el:20062195
File:
PDF, 136 KB
english, 2006
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