Characterization of Bi–Ag–X Solder...

IEEE Transactions on Components Packaging and Manufacturing Technology 2014 / 11 Vol. 4; Iss. 11

Characterization of Bi–Ag–X Solder for High Temperature SiC Die Attach

Zhenzhen Shen,, Kun Fang,, Johnson, R. Wayne, Hamilton, Michael C.
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
4
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2014.2345500
Date:
November, 2014
File:
PDF, 5.16 MB
english, 2014
Conversion to is in progress
Conversion to is failed