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ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Simultaneous Double Side Grinding of Silicon Wafers: A Further Investigation into Grinding Marks Pattern
Li, Zhichao, Lin, Bin, Sun, Wangping, Zhang, XiaohongYear:
2010
Language:
english
DOI:
10.1149/1.3360650
File:
PDF, 289 KB
english, 2010