Effect of Pad Surface Micro-Texture on Coefficient of...

Electrochemical and Solid-State Letters 2011 Vol. 14; Iss. 5

Effect of Pad Surface Micro-Texture on Coefficient of Friction and Removal Rate during Copper CMP Process

Liao, X., Zhuang, Y., Borucki, L. J., Theng, S., Wei, X., Ashizawa, T., Philipossian, A.
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Volume:
14
Year:
2011
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.3555072
File:
PDF, 3.82 MB
english, 2011
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