Defect Inspection of Flip Chip Solder Bumps Using an...

Sensors 2013 / 11 Vol. 13; Iss. 12

Defect Inspection of Flip Chip Solder Bumps Using an Ultrasonic Transducer

Su, Lei, Shi, Tielin, Xu, Zhensong, Lu, Xiangning, Liao, Guanglan
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Volume:
13
Language:
english
Journal:
Sensors
DOI:
10.3390/s131216281
Date:
November, 2013
File:
PDF, 1013 KB
english, 2013
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