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Electroless Cu Bottom-Up Filling Using 3-N,N-Dimethylaminodithiocarbamoyl-1-propanesulfonic acid
Lee, Chang Hwa, Cho, Sung Ki, Kim, Jae JeongVolume:
8
Year:
2005
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.2063291
File:
PDF, 473 KB
english, 2005