Chemical Modification of Buildup Epoxy Surfaces for...

Chemical Modification of Buildup Epoxy Surfaces for Altering the Adhesion of Electrochemically Deposited Copper

Siau, Sam, Vervaet, Alfons, Schacht, Etienne, Degrande, Siska, Callewaert, Kristof, Van Calster, Andre
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Volume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1952727
File:
PDF, 863 KB
english, 2005
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