![](/img/cover-not-exists.png)
Chemical Modification of Buildup Epoxy Surfaces for Altering the Adhesion of Electrochemically Deposited Copper
Siau, Sam, Vervaet, Alfons, Schacht, Etienne, Degrande, Siska, Callewaert, Kristof, Van Calster, AndreVolume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1952727
File:
PDF, 863 KB
english, 2005