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[IEEE 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Kyoto, Japan (2015.4.14-2015.4.17)] 2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Cu-Cu direct bonding technology using ultrasonic vibration for flip-chip interconnection
Arai, Yoshiyuki, Nimura, Masatsugu, Tomokage, HajimeYear:
2015
Language:
english
DOI:
10.1109/ICEP-IAAC.2015.7111060
File:
PDF, 3.49 MB
english, 2015