DSC and DMTA studies of a thermal interface material for...

DSC and DMTA studies of a thermal interface material for packaging high speed microprocessors

Yi He
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Volume:
392-393
Year:
2002
Language:
english
Pages:
9
DOI:
10.1016/s0040-6031(02)00065-5
File:
PDF, 192 KB
english, 2002
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