Thermal properties of rigid rod epoxies cured with diaminodiphenylsulfone and dicyandiamide
Wei-Fang Su, Hong-Wen Huang, Wei-Ping PanVolume:
392-393
Year:
2002
Language:
english
Pages:
4
DOI:
10.1016/s0040-6031(02)00125-9
File:
PDF, 72 KB
english, 2002