![](/img/cover-not-exists.png)
Diffusion Barrier Characteristics of Electroless Co(W,P) Thin Films to Lead-Free SnAgCu Solder
Pan, Hung-Chun, Hsieh, Tsung-EongVolume:
158
Year:
2011
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/2.004111jes
File:
PDF, 651 KB
english, 2011