Improvement of Thickness Uniformity of Bulk Silicon Wafer by Numerically Controlled Local Wet Etching
Yamamura, Kazuya, Mitani, Takuro, Ueda, Kazuaki, Nagano, Mikinori, Zettsu, NobuyukiVolume:
407-408
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.407-408.372
Date:
February, 2009
File:
PDF, 557 KB
english, 2009