Electrodeposition of Cu/Ni–P multilayers by a single bath technique
Takeshi Miyake, Michiyuki Kume, Koichi Yamaguchi, Dinesh P Amalnerkar, Hideki MinouraVolume:
397
Year:
2001
Language:
english
Pages:
7
DOI:
10.1016/s0040-6090(01)01359-1
File:
PDF, 1.57 MB
english, 2001