Zincating morphology of aluminum bond pad: its influence on...

Zincating morphology of aluminum bond pad: its influence on quality of electroless nickel bumping

Guojun Qi, Lambertus G.J. Fokkink, Kee Heng Chew
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Volume:
406
Year:
2002
Language:
english
Pages:
5
DOI:
10.1016/s0040-6090(01)01759-x
File:
PDF, 889 KB
english, 2002
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