Correlation between microstructure and barrier properties of TiN thin films used Cu interconnects
M Moriyama, T Kawazoe, M Tanaka, M MurakamiVolume:
416
Year:
2002
Language:
english
Pages:
9
DOI:
10.1016/s0040-6090(02)00602-8
File:
PDF, 1.42 MB
english, 2002