Testing of Bond Behavior of UHPC

Advanced Materials Research 2014 / 10 Vol. 1054

Testing of Bond Behavior of UHPC

Čítek, David, Huňka, Petr, Řeháček, Stanislav, Mandlík, Tomáš, Kolísko, Jiří
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Volume:
1054
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.1054.95
Date:
October, 2014
File:
PDF, 1.43 MB
english, 2014
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