Solder Bumps Inspection UsingPrincipal Component Analysis in Active Thermography
Lu, Xiang Ning, Han, Ji Guang, Han, Su Hua, Wang, Su Ya, Shao, Ming HuiVolume:
912-914
Language:
english
Journal:
Advanced Materials Research
DOI:
10.4028/www.scientific.net/AMR.912-914.1529
Date:
April, 2014
File:
PDF, 469 KB
english, 2014