Optimal Parameter Design of Solder Residue in Flip Chip...

Optimal Parameter Design of Solder Residue in Flip Chip Process by Using Taguchi Method

Kuo, Jian Long, Chao, Kai Lun, Kuo, Chun Cheng
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Volume:
443
Language:
english
Journal:
Key Engineering Materials
DOI:
10.4028/www.scientific.net/KEM.443.543
Date:
June, 2010
File:
PDF, 467 KB
english, 2010
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