![](/img/cover-not-exists.png)
Deposition mechanism of MOCVD copper films in the presence of water vapor
Jung-Yeul Kim, Young-Ki Lee, Hoon-Soo Park, Jong-Wan Park, Dong-Koo Park, Jin-Ho Joo, Won-Hee Lee, Young-Kyu Ko, P.J. Reucroft, Bum-Rae ChoVolume:
330
Year:
1998
Language:
english
Pages:
6
DOI:
10.1016/s0040-6090(98)00597-5
File:
PDF, 607 KB
english, 1998