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[IEEE 2011 IEEE International 3D Systems Integration Conference (3DIC) - Osaka (2012.01.31-2012.02.2)] 2011 IEEE International 3D Systems Integration Conference (3DIC), 2011 IEEE International - A thermal-aware mapping algorithm for reducing peak temperature of an accelerator deployed in a 3D stack
Mehdipour, Farhad, Nunna, Krishna Chaitanya, Gauthier, Lovic, Inoue, Koji, Murakami, KazuakiYear:
2012
DOI:
10.1109/3DIC.2012.6263034
File:
PDF, 494 KB
2012